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Internationalisation of innovation : why is chip design moving to Asia?

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Item Summary

Title: Internationalisation of innovation : why is chip design moving to Asia?
Authors: Ernst, Dieter
LC Subject Headings: Integrated circuits - Very large scale integration - Design and construction - Asia
Electronic industries - Vertical integration - Asia
Vertical integration
Systems on a chip
Issue Date: 2003
Publisher: Honolulu: East-West Center
Series/Report no.: East-West Center working papers. Economics series ; no. 64
Description: For more about the East-West Center, see
Pages/Duration: 42 pages
Appears in Collections:Economics [Working Papers]

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